The Holistic Modular Energy-efficient Directed-cooling UC Solution (HoMEDUCS) is a containerized modular data center designed to address the growing demand for high-density computing in a flexible, efficient format. HoMEDUCS modules will be built in standard shipping containers in plug-n-play format with no use of water and facility requirement with power density and redundancy levels customized to user specifications.
Power Density
The system can provide up to 240kW per rack in its highest density configuration, more than ten times more powerful than 95% of data centers today. HoMEDUCS containerized module can house a datacenter up to 1.5MW of IT load in foot print of two 20-foot containers coupled together. HoMEDUCS’s power density can address the rapid growth of AI and high-performance computing workloads, which Uptime Institute now estimates accounts for 28% of the workloads driving high-density data center deployments.
Source: Donnellan, D., Lawrence, A., Bizo, D., Judge, P., O’Brien, J., Davis, J., Smolaks, M., Williams-George, J., & Weinschenk, R. (2024). The Uptime Institute Global Data Center Survey 2024. The Uptime Institute. https://datacenter.uptimeinstitute.com/rs/711-RIA-145/images/2024.GlobalDataCenterSurvey.Report.pdf?version=0&mkt_tok=NzExLVJJQS0xNDUAAAGVdaF3sIsfHAId-F8XKMbkgTgU2XXbil5BnFt0ggXDWXXyICrOfk4yvIwD-3X7FRyp8V6l-FsN5ifsQgpLH-p8xpBkWXRTFkJaLczxTQYTXliN
Hyper Efficient Cooling
HoMEDUCS uses specialized cold plates to deliver targeted cooling at the individual component level (for CPUs, GPUs, and memory) or the server level for lower power-density applications. This cooling system operates as a closed primarily liquid loop where the heat rejection to outdoor air will occur through ultra-efficient patented Microchannel Polymer Heat eXchangers (MPHX), eliminating external water connections and waste. The superior efficiency of this cooling approach allows HoMEDUCS to be more energy efficient and less expensive to operate than even direct air cooling at lower power densities below 5% of IT load
Repurposed Heat
The MPHX can direct the heat drawn from the chips to the outdoors or a waste heat application (e.g., powering turbines to generate electricity, heating greenhouses or buildings). This design aspect aligns with growing interests in improving overall energy efficiency and reducing the environmental impact of data centers. For example, both the hyper efficient cooling and the repurposed heat mechanism position the HoMEDUCS in the highest efficiency category (W+) of the ASHRAE TC 9.9 Thermal Guidelines.
Rapid Deployment
The containerized, modular nature of HoMEDUCS allows for rapid deployment of high-density computing capacity. In roughly the time it takes to secure permitting, customized HoMEDUCS configuration can be installed to facilitate edge computing, IoT applications, or temporary installations in remote locations. Furthermore, the modular containerized structure approach allows for prefabrication and pre-certification of the datacenter and its components. This approach provides an advantage in navigating the landscape of regulatory compliance, as pre-certification can cover aspects such as electrical safety, fire suppression systems, structural integrity, and energy efficiency standards.
