The Holistic Modular Energy-efficient Datacenters (HoME2) is a containerized modular data center designed to address the growing demand for high-density computing in a flexible, efficient format. HoME2 modules will be built in standard shipping containers in plug-n-play format with no use of water and facility requirement with power density and redundancy levels customized to user specifications.
Power Density
HoME2 is designed to support a wide range of rack power densities, from tens of kilowatts to hundreds of kilowatts per rack. A single HoME2 containerized module, consisting of two coupled 20-foot containers, can accommodate up to 1.5 MW of IT load within a compact footprint. Building on this capability, the HoME2 platform is actively demonstrating a pathway toward supporting 1 MW-class racks, enabling the next generation of AI and high-performance computing infrastructure. With its ultra-high-density architecture, HoME2 is well positioned to meet the increasing power and cooling demands of emerging compute workloads while maximizing space efficiency.
Hyper Efficient Cooling
HoME2 uses specialized cold plates to deliver targeted cooling at the individual component level (for CPUs, GPUs, and memory) or the server level for lower power-density applications. This cooling system operates as a closed primarily liquid loop where the heat rejection to outdoor air will occur through ultra-efficient patented Microchannel Polymer Heat eXchangers (MPHX), eliminating external water connections and waste. The superior efficiency of this cooling approach allows HoME2 to be more energy efficient and less expensive to operate than even direct air cooling at lower power densities below 5% of IT load
Repurposed Heat
The MPHX can direct the heat drawn from the chips to the outdoors or a waste heat application (e.g., powering turbines to generate electricity, heating greenhouses or buildings). This design aspect aligns with growing interests in improving overall energy efficiency and reducing the environmental impact of data centers. For example, both the hyper efficient cooling and the repurposed heat mechanism position the HoME2 in the highest efficiency category (W+) of the ASHRAE TC 9.9 Thermal Guidelines.
Rapid Deployment
The containerized, modular nature of HoME2 allows for rapid deployment of high-density computing capacity. In roughly the time it takes to secure permitting, customized HoME2 configuration can be installed to facilitate edge computing, IoT applications, or temporary installations in remote locations. Furthermore, the modular containerized structure approach allows for prefabrication and pre-certification of the datacenter and its components. This approach provides an advantage in navigating the landscape of regulatory compliance, as pre-certification can cover aspects such as electrical safety, fire suppression systems, structural integrity, and energy efficiency standards.
RESOURCES
- Performance Modeling of a Microchannel-Based Efficient Low-Cost Thermal Energy-Storage Device (2026 | ASHRAE Poster)
- Thermal Design and Performance Modeling of a High Compute Density Liquid Cooled Chiller Less Modular Edge Data Center (2026 | Peer-Reviewed Article)
- Beyond Air: Energy Performance and Market Insights for Data Center Liquid Cooling Strategies (2026 | White Paper)
- PATENT US20240410662A1: Designs and Applications of a Low-Drag, High-Efficiency Microchannel Polymer Heat Exchanger
- PATENT US20220010981A1: Low-drag, high-efficiency microchannel polymer heat exchangers
- Making sustainability central to the data centers of the future (Press Release 2026 | ScienceDirect)
- Companies Are Racing to Fuel and Cool AI ( 2025 | Comstocks)
- Holistic Modular Energy-efficient Directed Cooling Solutions (HoMEDUCS) for Edge Computing (Press Release 2023 | ARPA-E)
Questions?
Contact the R&D Engineering Supervisor, Erfan Rasouli ( erasouli@ucdavis.edu )