WCEC researchers traveled to San Diego to participate in the ARPA-E Energy Innovation Summit, where they presented a modular, high-efficiency approach to data center design and cooling.
The system is a containerized data center built in standard shipping modules that integrate computing equipment with a closed-loop liquid cooling system. Instead of relying on conventional air cooling, it uses direct-to-chip liquid cooling and high-efficiency heat exchangers. This approach allows the system to support much higher power densities while reducing energy use and eliminating the need for external water connections. The modular design also enables rapid deployment and flexible scaling, making it suitable for emerging high-performance computing and AI workloads.
The ARPA-E Energy Innovation Summit brings together researchers, industry leaders, and investors to highlight emerging energy technologies and support their transition from research to real-world deployment.